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Conference title is ‘The Future of Flexo: New Year, New Technology.’
January 22, 2019
By: DAVID SAVASTANO
Harper Corporation of America will participate as an exhibitor and speaker at “The Future of Flexo: New Year, New Technology,” an open house presented by OMET Americas. This free event will be held at Clemson University’s Sonoco Institute of Packaging Design and Graphics, which includes a Varyflex narrow web press by OMET in its Advanced Print Lab. Harper Corporation of America is a sponsor of the event. In addition, Sean Teufler, technical director at Harper, will be presenting on “New Technology and Understanding Coating Applications.” The event will be held Feb. 6-7, 2019 at Clemson University’s Sonoco Institute, Clemson, SC.
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